Renesas Electronics Corporation released the DA14592 Bluetooth Low Energy (LE) System-on-Chip (SoC), designed for power efficiency and compactness with a multi-core structure. The…
Infineon Technologies AG has introduced the XENSIV™ TLI5590-A6W magnetic position sensor, designed for linear and angular incremental position detection in industrial and consumer…
Littelfuse, Inc. (NASDAQ: LFUS), introduced TTape, an overtemperature detection platform designed for Li-ion battery systems. TTape is intended for applications in automotive EV/…
Allegro MicroSystems, Inc. has announced the launch of AHV85111 isolated gate-driver IC which is the second product in its High Voltage Power portfolio. This new isolated gate-…
MORNSUN introduced the LBH300-138xx as part of its AC/DC BRICK power supplies LBH series, focusing on high-efficiency power supply within a half-brick package, intended mainly for…
Onsemi introduced nine new EliteSiC Power Integrated Modules (PIMs) focused on enabling bidirectional charging for DC ultra-fast EV chargers and energy storage systems. These…
Alpha and Omega Semiconductor unveiled two new αMOS5™ 600V FRD Super Junction MOSFETs. The αMOS5™ platform is known for its high voltage capabilities, catering to various sectors…
MORNSUN unveiled the VCB_SBO-200W(F)R3(-N) series, a 1/16 brick high-power density DC/DC converter designed for the rapid evolution of the 5G industry. This innovation addresses…
RECOM introduces the RMD150 and RMD300 series, cost-effective railway DC/DC converters compliant with industry standards. Featuring a regulated single output with a wide input…