NXP
Murata's New Module Enhances IoT Connectivity with Dual Support for Wi-Fi 6 and Matter
Murata, a prominent electronics manufacturer, recently showcased its latest engineering innovations at Embedded World 2023 in Nuremberg, Germany.
M.2 Cards with Wi-Fi and Bluetooth Modules for Wireless Connectivity Options
u‑blox has introduced a set of Wi-Fi 5, Wi-Fi 6, and Bluetooth expansion cards that plug into NXP Semiconductors’ i.MX processor evaluation kits.
High Performing 16nm FinFET Technology-Based New Automotive Processors Released for Radar and Vehicle Networking
Continuing to deliver the improved performance and rigorous automotive process qualifications to deliver safe next-generation computing power, NXP Semiconductors has announced the release of two new advanced processors,
Ultra-Low IQ PMIC Powers iMX8M Nano for Delivering High Performance in Embedded Artists Industrial Control Boards
ROHM Semiconductors has announced that Embedded Artists is using the BD71847AMWV, a highly integrated PMIC from ROHM along with NXP’s i.MX 8M Nano processor on its iMX8M Nano uCOM board.
New Wi-Fi 6 devices use Wi-Fi 6E Tri-Band Chipset for Increased Capacity, Reliability, and Improved Latency in Access Devices
NXP Semiconductors is laying the foundation for a new era of Wi-Fi 6 devices that operate in the 6GHz band with the help of the CW641 WiFi 6E Tri-Band System-on-chip (SoC). The ne
BlueBox 3.0 – Third Generation Development Platform for Safe Automotive High-Performance Computing
BlueBox 3.0, a new and expanded Automotive High-Performance Compute (AHPC) development platform from NXP Semiconductors allows the developers to accelerate the system development cycle and speed time t
New Radar Sensor Chipset Solutions with 4D Imaging Radar to Identify and Classify the Surrounding Vehicles
NXP Semiconductors has introduced new radar sensor chipset solutions that can surround vehicles in a 360-degree safety cocoon and allow the imaging radar to identify and classify
LDMOS Technology-based Airfast Power Multi-Chip Modules (MCMs) for High Output Power, Efficiency, and Extended Frequency Coverage
NXP Semiconductors has introduced AFSC5G26E38, 2nd generation comprehensive Airfast RF power Multi-Chip Modules (MCMs) for supporting the evolution of 5G mMIMO active antenna system
High Performance, Low Power, and Long Range Dual Band WiFi-6 and Bluetooth/BLE Solutions for Gaming, Audio, Industrial, and IoT Applications
NXP Semiconductors has announced the launch of 2x2 Wi-Fi 6 (802.11ax) Dual-Band + Bluetooth/BLE solutions for advanced gaming, audio, industrial, and IoT markets.