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High-Density Dual-Phase Power Modules for AI Data Centers

TDM2254xD Series Dual-Phase Power Modules
TDM2254xD Series Dual-Phase Power Modules

Infineon Technologies AG recently launched its TDM2254xD series dual-phase power modules, designed to offer superior power density, quality, and total cost of ownership (TCO) for AI data centers. These modules combine robust OptiMOS TM MOSFET technology with innovative packaging and a proprietary magnetic structure to deliver top-notch electrical and thermal performance alongside a sturdy mechanical design. This enables data centers to operate more efficiently, meeting the high-power demands of AI GPU platforms while significantly reducing TCO. The TDM2254xD dual-phase power modules, coupled with XDP TM Controller technology, facilitate efficient voltage regulation for high-performance computing platforms, ensuring superior electrical, thermal, and mechanical operation.  Infineon introduced the TDM2254xD series at the Applied Power Electronics Conference (APEC). 

These modules feature a distinctive design facilitating efficient heat transfer from the power stage to the heat sink through an optimized inductor design. This design leads to a 2 percent higher efficiency compared to industry average modules at full load, resulting in significant energy savings and reduced CO2 emissions over the system's lifetime. These modules excel with industry-leading power density and vertical power delivery, reducing losses. Achieving 2% higher efficiency than competitors, they ensure optimal energy utilization. Additionally, their advanced thermal management keeps temperatures 5°C cooler at full load. Overall, these modules offer best-in-class total cost of ownership, delivering superior performance and value.

Features:

  • Leading power density: 10x9x8 mm + 10x9x5 mm for 160 A peak.
  • Vertical power delivery minimizes losses.
  • Achieves 2% higher efficiency than competitors at full load.
  • Superior thermal management: -5°C cooler at full load compared to competitors.
  • Outstanding total cost of ownership

Applications:

  • High-performance computing platforms
  • AI data centers
  • GPU platforms
  • Industrial power systems
  • Automotive power applications

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